ALEXANDRIA, Va., July 15 -- United States Patent no. 12,660,855, issued on June 23, was assigned to Shanghai QV Technologies Co. Ltd. (Shanghai).

"Atomization core" was invented by Xiaofeng Peng (Oakville, Canada) and Qiwen Peng (Oakville, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to the field of atomization applications. More specifically, the disclosure relates to an atomization core, comprising a core substrate and a heating body on the core substrate, wherein the core substrate is made of a dense material (e.g., dense ceramics), with e-liquid transferring perforations distributed in the substrate; the diameter of the e-liquid transferring perforations is 1-250 m...