US Patent Issued to SHANGHAI JIAO TONG UNIVERSITY on Jan. 20 for "Solder-free joint and welding method thereof" (Chinese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,132, issued on Jan. 20, was assigned to SHANGHAI JIAO TONG UNIVERSITY (Shanghai).

"Solder-free joint and welding method thereof" was invented by Zhen Huang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solder-free joint and a welding method thereof are provided. The welding method includes the following steps: S1: uniformly coating a flux on a surface of each of a plurality of materials to be soldered, thereby forming a flux layer; S2: performing binding according to the surface of the material, the flux layer, and the surface of the material; and S3: putting the materials into a hot-pressing device, and setting a desired pressure and t...