US Patent Issued to SHANGHAI JIAO TONG UNIVERSITY on Dec. 23 for "Heat dissipation optimization method of silicon-based SU-8 thin film package" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,041, issued on Dec. 23, was assigned to SHANGHAI JIAO TONG UNIVERSITY (Shanghai).

"Heat dissipation optimization method of silicon-based SU-8 thin film package" was invented by Linsheng Wu (Shanghai), Xianglin Zhong (Shanghai), Zhonglin Xu (Shanghai), Liangfeng Qiu (Shanghai) and Junfa Mao (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation optimization method for silicon-based SU-8 thin film packaging, a molybdenum copper sheet is arranged on the back of the embedded chip, and the chip wiring and interconnection is realized on the front side of the silicon substrate through the metal pattern on the SU-8 photoresist, the sili...