US Patent Issued to SHANGHAI AEROSPACE SCIENCE & INDUSTRY APPLIANCE on Feb. 10 for "Conductor structure and electrical connection module" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,548,932, issued on Feb. 10, was assigned to SHANGHAI AEROSPACE SCIENCE & INDUSTRY APPLIANCE Co. LTD (Shanghai).

"Conductor structure and electrical connection module" was invented by Xu Wang (Shanghai), Tengfei Zeng (Shanghai), Jian Wang (Shanghai), Jun Wang (Shanghai) and Zimin Zhang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A welding foot portion of an conductor structure is welded with a circuit board; a back bending structure and a bending structure which are connected to each other are formed at a middle bending portion of the conductor structure; a first interference area and a second interference area are provided; a sliding insert...