US Patent Issued to SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION on Sept. 15 for "Metamaterial structure and forming method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,735,322, issued on Sept. 15, was assigned to SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION (Seoul, South Korea).

"Metamaterial structure and forming method thereof" was invented by In Chung (Seoul, South Korea), Hyungseok Lee (Seoul, South Korea) and Myeongjeong Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A metamaterial structure and a forming method thereof are provided. The metamaterial structure according to embodiments of the present invention comprises first metamaterial unit structures and second metamaterial unit structures, and the first metamaterial unit structures and the second metamaterial unit structures are arranged...