ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,320, issued on Aug. 26, was assigned to Sensors Inc. (Delano, Minn.).

"Method and system for inspecting packages for packaging defects" was invented by David J. Kotula (Maple Plain, Minn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods are disclosed for detecting package defects in packages transported on a conveyance. 3D imaging data is gathered for a 3D package having multiple nominally planar faces. The 3D imaging data is classified into different data groups associated with respective nominally planar faces and/or nominally straight edges of the 3D package. For each such face and/or edge, data associated with that face and/or ...