ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,738, issued on May 26, was assigned to SENJU METAL INDUSTRY Co. Ltd. (Tokyo).
"Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint" was invented by Takahiro Yokoyama (Saitama, Japan), Kanta Dei (Tokyo), Takahiro Matsufuji (Tokyo), Hikaru Nomura (Tokyo) and Shunsaku Yoshikawa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solder alloy includes an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. A solder paste includes a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0....