ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,061, issued on March 24, was assigned to Senju Metal Industry Co. Ltd. (Tokyo).
"Solder alloy, solder paste, and solder joint" was invented by Takahiro Yokoyama (Tokyo), Shunsaku Yoshikawa (Tokyo), Yuki Iijima (Tokyo), Kanta Dei (Tokyo), Takahiro Matsufuji (Tokyo), Kota Sugisawa (Tokyo) and Shigeto Suzuki (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a solder alloy, a solder paste, and a solder joint that exhibit a suitable melting temperature, are excellent in wettability, are high in tensile strength and shear strength, and are further excellent in drop impact resistance. The solder alloy has the following alloy composition. ...