ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,794, issued on April 21, was assigned to SENJU METAL INDUSTRY Co. LTD. (Adachi-ku, Japan).
"Flux and solder paste" was invented by Mutsuki Kaneko (Tokyo), Ryuichi Tsuda (Tokyo) and Kazuyori Takagi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention employs a flux containing a resin component, an activator, and a solvent. The resin component contains a copolymer (A) having an alkene-derived repeating unit (a1), and an acrylic acid-derived repeating unit (a2) in which a hydrogen atom bonded to a carbon atom at an Alpha-position may be substituted with a substituent, and contains a rosin (B). A mixing ratio of the copolymer (A)...