ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,251, issued on Dec. 2, was assigned to SEMIGHT INSTRUMENTS Co. LTD (Suzhou, China).

"Adaptive chip testing apparatus and formation method thereof" was invented by Zhe Lian (Suzhou, China), Jianjun Huang (Suzhou, China), Yonghong Wu (Suzhou, China), Shan Zhao (Suzhou, China) and Haiyang Hu (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an adaptive die testing apparatus and a formation method. The adaptive die testing apparatus includes a support frame capable of moving along a vertical direction; a movable panel capable of moving along a horizontal direction; an upper test socket installed on the support ...