US Patent Issued to Semiconductor Manufacturing International (Shanghai) on Oct. 6 for "Inductor coil and forming method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,885, issued on Oct. 6, was assigned to Semiconductor Manufacturing International (Shanghai) Corp. (Shanghai).

"Inductor coil and forming method thereof" was invented by Xiaodong Wang (Shanghai), Weihong Qian (Shanghai) and Xining Wang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "An inductor coil includes: a substrate, including a base, a device layer on the base, a conductive layer, and an electrical interconnect structure; a plurality of stacked coil layers being on the substrate, each of the plurality of stacked coil layers including a plurality of sub-coil structures on a same layer; and a plurality of electrical connection layers betw...