US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on June 9 for "Leadframe mounting with lead insertion for lead wall bonding" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,759, issued on June 9, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Leadframe mounting with lead insertion for lead wall bonding" was invented by Chad Chen (Suzhou, China), Jiahui Liu (Suzhou, China), Wuxing Xia (Suzhou, China) and Jingyan Liu (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package may include a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion. The semiconductor device package may include a leadframe having a lead that is sold...