US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on July 28 for "Sealing method for direct liquid cooled power electronics package" (South Korean, American Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,430, issued on July 28, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Sealing method for direct liquid cooled power electronics package" was invented by Roveendra Paul (Dublin, Calif.) and Hyungsoo Kim (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a power electronics module disposed between a first bracket and a second bracket with the power electronics module covering openings in the first bracket and the second bracket. Leak-proof joints are formed between surfaces of the power electronics module and the first bracket and the second bracket. A first cover beam is disposed ...