US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Jan. 20 for "Image sensor packaging structures and related methods" (Singaporean, Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,559, issued on Jan. 20, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Image sensor packaging structures and related methods" was invented by Chee Peng Neo (Singapore) and Yu-Te Hsieh (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of an image sensor package may include an image sensor die including at least one bond pad thereon; a bond wire wirebonded to the at least one bond pad; and an optically transmissive lid coupled to the image sensor die with an optically opaque film adhesive over the at least one bond pad. The bond wire may extend through the optically opaque film adhesive to t...