US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Jan. 20 for "Backside illumination image sensors" (Oregon, Washington Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,563, issued on Jan. 20, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Backside illumination image sensors" was invented by Jeffrey Peter Gambino (Gresham, Ore.), Rick Jerome (Washougal, Wash.) and David T. Price (Gresham, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of image sensor devices may include a through-silicon-via (TSV) formed in a backside of an image sensor device and extending through a material of a die to a metal landing pad. The metal landing pad may be within a contact layer. The devices may include a TSV edge seal ring surrounding a portion of the TSV in the contact layer and ex...