US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Dec. 2 for "Flexible clip with aligner structure" (Singaporean, Chinese, Philippine Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,080, issued on Dec. 2, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Flexible clip with aligner structure" was invented by Keunhyuk Lee (Suzhou, China), Jerome Teysseyre (Singapore) and Tiburcio A. Maldo (Consolacion, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A clip preform includes a die contact portion and an aligner structure. An intermediate portion connects the die contact portion to a lead contact portion in the aligner structure. The die contact portion is configured to contact a semiconductor die. The aligner structure is configured to attach the lead contact portion to a lead post. The die con...