US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Aug. 25 for "Through-substrate-via in photosensitive module" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,900, issued on Aug. 25, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Through-substrate-via in photosensitive module" was invented by Ming-Yao Chen (Taipei City, Taiwan), Chien-Wei Chang (Taipei, Taiwan) and Chih-Hung Tu (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes an optical sensor die. The optical sensor die has an optically active surface area (OASA) disposed on a front side of a substrate. A glass cover is disposed above the OASA and attached to the front side the substrate by a dam material. A through-substrate via (TSV) extends from an opening at a back side of the subs...