US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on April 21 for "Single switch direct cooling assemblies and related methods" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,818, issued on April 21, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Single switch direct cooling assemblies and related methods" was invented by Oseob Jeon (Seoul, South Korea), Yoonsoo Lee (Incheon, South Korea), Bosung Won (Seoul, South Korea) and Youngsun Ko (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a dual sided cooling module may include a high side module coupled over a low side module through a coupling heat sink at a first largest planar surface of the high side module and at a first largest planar surface of the low side module; a high side heat sink coupled at...