ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,734,799, issued on Sept. 15, was assigned to Semes Co. Ltd. (Chungcheongnam-do, South Korea).

"Substrate treating control method, substrate treating apparatus, substrate treating method and computer program stored in computer readable medium for treating substrate" was invented by Sang Hoon Kim (Incheon, South Korea) and Jae Hun Jeong (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The inventive concept provides a substrate treating control method. The substrate treating control method includes discharging a droplet to a substrate in which a relative position to the head unit changes from a nozzle of a head unit, and wherein a c...