ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,736,464, issued on Sept. 15, was assigned to Semes Co. Ltd. (Chungcheongnam-do, South Korea).
"Substrate measurement method and substrate measurement control apparatus" was invented by Dong Seop Jung (Cheonan-si, South Korea) and Hark Ryong Kim (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate measurement method and substrate measurement control apparatus capable of greatly reducing measurement time by skipping a general identification mark recognition process, the substrate measurement method including (a) obtaining entire coordinates for an entire area of wafer by using a standard wafer, (b) aligning a me...