ALEXANDRIA, Va., May 19 -- United States Patent no. 12,633,500, issued on May 19, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea).
"Method of treating substrate and apparatus for treating substrate" was invented by Myoungsub Noh (Hwaseong-si, South Korea), Seong Gil Lee (Hwaseong-si, South Korea), Dong-Hun Kim (Gunpo-si, South Korea), Dong Sub Oh (Busan, South Korea), Jountaek Koo (Seoul, South Korea) and Wan Jae Park (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The apparatus includes a plasma chamber and a process chamber separated by an ion blocker. A plasma power source excites a first treatment gas into radicals, which mix with a second treatment gas in the process ch...