ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,444, issued on March 31, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea).
"Bonding apparatus and bonding power terminal of heating plate" was invented by Min Hee Cho (Gyeonggi-do, South Korea) and Jun Ho Song (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a bonding apparatus for a power terminal of a heating plate, for bonding the power terminal supplying power to a heating wire of a substrate. The bonding apparatus for a power terminal of a heating plate comprises: a chamber; a stage which is disposed in an inner space of the chamber and on which the substrate is placed; an...