ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,987, issued on June 9, was assigned to Semes Co. LTD. (Cheonan-si, South Korea).
"Apparatus for treating substrate and method for treating a substrate" was invented by Jin Yeong Sung (Hwaseong-si, South Korea), Ki Hoon Choi (Cheonan-si, South Korea), Hyun Yoon (Seoul, South Korea), Sang Hyeon Ryu (Yangpyeong, South Korea) and Young Ho Park (Incheon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The inventive concept provides a substrate treating method for etching a specific region on a substrate. The substrate treating method includes supplying a treating liquid to the substrate; and irradiating a laser to the specific region to loca...