ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,862, issued on Feb. 24, was assigned to Semes Co. Ltd. (Chungcheongnam-do, South Korea).
"Substrate treating apparatus and substrate treating method" was invented by Ji Hoon Jeong (Hwaseong-si, South Korea), Young Dae Chung (Incheon, South Korea) and Hyun Yoon (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method of treating a substrate, the method including: supplying a liquid to the substrate, emitting a laser to the substrate supplied with the liquid to heat the substrate, and emitting imaging light for capturing the substrate to obtain an image of the substrate including a region to which the laser is emitted, ...