US Patent Issued to SEMES on Feb. 17 for "Wafer treatment apparatus capable of measuring warpage of wafer and method of measuring warpage of wafer" (South Korean Inventor)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,589, issued on Feb. 17, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea).

"Wafer treatment apparatus capable of measuring warpage of wafer and method of measuring warpage of wafer" was invented by Young Jun Son (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a wafer treatment apparatus capable of measuring warpage of a wafer, the wafer treatment apparatus including a support plate providing a surface on which the wafer is supported, a temperature control channel mounted in the support plate to provide a path through which a fluid flows, and a plurality of warpage measurers disposed on the support plate and...