ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,669, issued on Feb. 10, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea).

"Substrate transfer module and semiconductor manufacturing equipment" was invented by Duk Hyun Son (Cheonan-si, South Korea) and Je Hee Lee (Uijeongbu-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate transfer module, which provides clean environment to prevent particles from moving to a substrate, and semiconductor manufacturing equipment including the same. The substrate transfer module of the semiconductor manufacturing equipment includes a transfer chamber providing a transfer space of the substrate, having a chamber groove lowered by a pre...