US Patent Issued to SEKISUI POLYMATECH on July 7 for "Thermally conductive sheet" (Japanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,674,035, issued on July 7, was assigned to SEKISUI POLYMATECH Co. LTD. (Saitama, Japan).

"Thermally conductive sheet" was invented by Hiromichi Iwazaki (Kounosu, Japan), Kentaro Kiuchi (Saitama-city, Japan), Kenta Kuroo (Shimamotocho, Japan) and Hiroki Kudoh (Kawaguchi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is a thermally conductive sheet comprising: a matrix comprising an organic polymer, and a carbon fiber X, the carbon fiber X being oriented in a thickness direction of the sheet, wherein a proportion of a carbon fiber (A) having a fiber length of 100 micro metre or less is 40% or more and a proportion of a carbon f...