US Patent Issued to SEKISUI POLYMATECH on Aug. 25 for "Thermally-conductive sheet, method for installing same, and method for manufacturing same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,012, issued on Aug. 25, was assigned to SEKISUI POLYMATECH Co. LTD. (Saitama, Japan).

"Thermally-conductive sheet, method for installing same, and method for manufacturing same" was invented by Kenta Kuroo (Saitama, Japan), Hiromichi Iwazaki (Saitama, Japan) and Hiroki Kudoh (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a heat-conductive sheet including: a binder component that is a mixture of a silicone matrix (A) and an alkyl silicone compound (B); and a heat-conductive filler (C) dispersed in the binder component, a content of the alkyl silicone compound (B) being 2.0 to 20 parts by mass with respect to 100 parts by m...