US Patent Issued to SEKISUI KASEI on Oct. 20 for "Fine resin particle and fine resin particle-containing composition" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,767,811, issued on Oct. 20, was assigned to SEKISUI KASEI Co. LTD. (Osaka, Japan).

"Fine resin particle and fine resin particle-containing composition" was invented by Kohei Tanaka (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A problem is to provide a fine resin particle formed by a simple method and capable of preventing fine resin particles from dropping out from substrates or binders and imparting scratch resistance to films, and a fine resin particle-containing composition. A solution is to provide a fine resin particle obtained by polymerizing one or two or more vinylic monomers and, in an infrared spectrum measured by an ATR method...