US Patent Issued to SEKISUI KASEI on March 24 for "Resin composition for semiconductor sealing, underfill material, mold resin, and semiconductor package" (Japanese Inventor)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,548, issued on March 24, was assigned to SEKISUI KASEI Co. LTD. (Osaka, Japan).

"Resin composition for semiconductor sealing, underfill material, mold resin, and semiconductor package" was invented by Koichiro Okamoto (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There are provided a resin composition for semiconductor sealing, an underfill, a mold resin, and a semiconductor package that exhibit an excellent low dielectric property by a non-conventional new approach. A resin composition for semiconductor sealing according to an embodiment of the present invention is a resin composition for semiconductor sealing containing a thermoset...