ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,723,178, issued on Sept. 1, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).
"Pressure-sensitive adhesive tape" was invented by Shouji Kaji (Shiraoka, Japan), Takaaki Sakon (Minamisaitama-gun, Japan) and Taku Sasaki (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The pressure-sensitive adhesive tape of the present invention is a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer comprising a photo-cured acrylic resin, a metal having a lower potential than that of iron, and an electroconductive material, wherein the pressure-sensitive adhesive layer has a total light transmittance X, per micrometer o...