ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,626, issued on Feb. 24, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).
"Resin composition, heat-radiating member, and electronic apparatus" was invented by Tetsurou Yoshioka (Kyoto, Japan), Osamu Inui (Yao, Japan), Hidehito Nishizawa (Takatsuki, Japan), Izumi Matsumoto (Kyoto, Japan) and Abison Scaria (Takatsuki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition of the present invention comprises: a silicone resin or a silicone oil (A), a compound (B) having a particular structure, and a thermally conductive filler (C). According to the present invention, a resin composition having favorable thermally conductive pro...