ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,394, issued on Dec. 2, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).
"Molding resin composition and molded article" was invented by Mitsuo Matsumoto (Yamaguchi, Japan), Ryota Yamasugi (Yamaguchi, Japan), Tomohiro Horinouchi (Yamaguchi, Japan), Yoshito Arai (Osaka, Japan), Yasunari Kusaka (Osaka, Japan) and Nami Nakajima (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention aims to provide a resin composition for molding that makes it possible to achieve excellent continuous productivity and to produce a molded article having high surface smoothness, capable of reducing defective molding, less likely to crack d...