US Patent Issued to SEIKO EPSON on Sept. 15 for "Semiconductor package" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,496, issued on Sept. 15, was assigned to SEIKO EPSON Corp. (Japan).

"Semiconductor package" was invented by Michiyoshi Takano (Okaya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a silicon interposer; a photosensitive resin disposed at the silicon interposer and including an opening portion; metal wiring disposed at the photosensitive resin and at the silicon interposer in the opening portion; a first bump disposed at the metal wiring in the opening portion; a semiconductor chip disposed above the first bump and including a pad electrically coupled to the first bump; and a second bump disposed at the metal ...