US Patent Issued to SEIKO EPSON on Sept. 15 for "Molding management system" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,734,739, issued on Sept. 15, was assigned to SEIKO EPSON Corp. (Japan).

"Molding management system" was invented by Shusaku Furuya (Miyada, Japan) and Yusuke Mitsuma (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molding management system includes: a first acquisition unit configured to acquire first abnormality information, second abnormality information, and third abnormality information; and a first output unit configured to output first warning information. The second abnormality information and the third abnormality information include information on an injection molding machine in the first abnormality information and informati...