US Patent Issued to SEIKO EPSON on March 31 for "Liquid ejecting head manufacturing method, liquid ejecting head, and liquid ejecting apparatus" (Japanese Inventor)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,592, issued on March 31, was assigned to SEIKO EPSON Corp. (Japan).

"Liquid ejecting head manufacturing method, liquid ejecting head, and liquid ejecting apparatus" was invented by Haruki Kobayashi (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a liquid ejecting head manufacturing method of manufacturing a second liquid ejecting head by regenerating a first liquid ejecting head that includes a first head chip ejecting a liquid, and a flow path structure having a first selection coupling portion and a second selection coupling portion that are flow path coupling portions to the first head chip, the method includin...