US Patent Issued to SEIKO EPSON on March 24 for "Electronic component, sensor module, and method for manufacturing electronic component" (Japanese Inventor)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,740, issued on March 24, was assigned to SEIKO EPSON Corp. (Japan).

"Electronic component, sensor module, and method for manufacturing electronic component" was invented by Manabu Kondo (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component includes: a substrate including a flexible wiring board having a first surface and a second surface that are in a front and back relationship, and a support plate having a first opening and joined to the first surface of the flexible wiring board; and a first component and a second component both disposed on the substrate. The substrate includes a first region in which the first...