US Patent Issued to SEIKO EPSON on June 23 for "Molding management device, production plan generation device, and molding machine control device" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,838, issued on June 23, was assigned to SEIKO EPSON Corp. (Japan).

"Molding management device, production plan generation device, and molding machine control device" was invented by Kosuke Atsuta (Shiojiri, Japan) and Yusuke Mitsuma (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molding management device for managing an injection molding machine includes: a first production unit information generation unit configured to generate first production unit information which is information on a molding job for molding the molded article; a second production unit information generation unit configured to generate second production unit in...