US Patent Issued to SEIKO EPSON on Feb. 24 for "Injection molding powder, injection molding powder production method, and metal sintered compact production method" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,722, issued on Feb. 24, was assigned to SEIKO EPSON Corp. (Japan).

"Injection molding powder, injection molding powder production method, and metal sintered compact production method" was invented by Yasutaka Matsumoto (Suwa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An injection molding powder includes a metal powder, and a film with which a particle surface of the metal powder is coated and which contains a fluorine compound, in which a contact angle of hexadecane measured at 25deg C. by a Theta/2 method is 60deg or more and 110deg or less in a state in which the injection molding powder is laid in layers."

The patent was filed on Feb....