US Patent Issued to SEIKO EPSON on Aug. 25 for "Support material removal device and support material removal method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,715,176, issued on Aug. 25, was assigned to SEIKO EPSON Corp. (Tokyo).

"Support material removal device and support material removal method" was invented by Kaname Nagatani (Matsumoto, Japan), Hirokazu Sekino (Chino, Japan) and Tomoki Abe (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a support material removal device for removing a support material from a three-dimensional molded object in an ejection target by ejecting liquid at the ejection target, which was molded by a three-dimensional molding machine, includes a nozzle for ejecting the liquid, an arm for gripping the nozzle, a trajectory calculating section for ...