US Patent Issued to SEIKO EPSON on April 21 for "Plasticized material supply device and three-dimensional shaping device" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,890, issued on April 21, was assigned to SEIKO EPSON Corp. (Japan).

"Plasticized material supply device and three-dimensional shaping device" was invented by Akihiko Tsunoya (Okaya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plasticized material supply device includes: a nozzle configured to discharge a plasticized material toward a stage; a first flow path through which a first plasticized material flows; a second flow path through which a second plasticized material flows; a third flow path through which the plasticized material flows; a flow rate adjusting mechanism provided at a junction of the first flow path, the second flow path,...