US Patent Issued to SCREEN Holdings on Feb. 10 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,839, issued on Feb. 10, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).

"Substrate processing method and substrate processing apparatus" was invented by Sei Negoro (Kyoto, Japan) and Kenji Kobayashi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to the present invention, a substrate W is provided with a recess 95. The width of the recess 95 is smaller than the depth of the recess 95. An etching target which is at least one of a single crystal of silicon, a polysilicon and an amorphous silicon is exposed in at least a part of the upper part of a lateral surface 95s and in at least a part of the lower part of the later...