ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,024, issued on March 31, was assigned to SCHOTT AG (Mainz, Germany).
"Method for separating substrates" was invented by Fabian Wagner (Mainz, Germany), Volker Plapper (Alzey, Germany), Andreas Ortner (Gau-Algesheim, Germany), Simon Schmitt (Wiesbaden, Germany), Frank-Thomas Lentes (Bingen, Germany), Albrecht Seidl (Niedernberg, Germany), Antal Makacs (Grossschwabhausen, Germany) and Patrick Bartholome (Jena, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a sep...