ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,964, issued on Sept. 15, was assigned to Schneider Electric (China) Co. Ltd. (Beijing).
"Heat dissipating assembly for circuit" was invented by Zhibao Wang (Beijing), Baoyun Bi (Beijing) and Xiaoqiang Li (Beijing).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure provides a heat dissipating assembly for a circuit, the circuit comprises a printed circuit board and a plurality of electronic components, the printed circuit board is provided with a plurality of first through holes for pins of the plurality of electronic components to pass through, the heat dissipating assembly comprises: a bracket connected to the prin...