US Patent Issued to SCHAEFFLER TECHNOLOGIESAG& Co. on Dec. 30 for "Semiconductor component arrangement, method for fabrication thereof and heat dissipation device" (German Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,386, issued on Dec. 30, was assigned to SCHAEFFLER TECHNOLOGIESAG& Co. KG (Herzogenaurach, Germany).

"Semiconductor component arrangement, method for fabrication thereof and heat dissipation device" was invented by Detlev Bagung (Munich), Christina Quest-Matt (Munich), Thomas Riepl (Munich) and Daniela Wolf (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation device for soldering onto a printed circuit board for a semiconductor component arrangement. The device includes a semiconductor component a first electrical connector and at least one further electrical connector and a prefabricated metal block group. The metal block group...