ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,766, issued on May 26, was assigned to SATO Corp. (Tokyo).
"IC chip-mounting device and IC chip-mounting method" was invented by Yoshimitsu Maeda (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and ...