ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,787, issued on March 3, was assigned to SATO Corp. (Tokyo).
"IC chip mounting device and IC chip mounting method" was invented by Yoshimitsu Maeda (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is an IC chip mounting apparatus including: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; an IC chip placement unit configured to place an IC chip on a photo-curable adhesive that is located on a reference position of each antenna in the antenna continuous body; and a light irr...