US Patent Issued to Sanmina on July 14 for "Ultra thin dielectric printed circuit boards with thin laminates and method of manufacturing thereof" (American, Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,704, issued on July 14, was assigned to Sanmina Corp. (San Jose, Calif.).

"Ultra thin dielectric printed circuit boards with thin laminates and method of manufacturing thereof" was invented by Shinichi Iketani (Sunnyvale, Calif.) and Toshiya Suzuki (Sagamihara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Ultra-thin dielectric printed circuit boards (PCBs) are provided. An ultra-thin dielectric layer may be coupled to a first conductive layer on a first side of the ultra-thin dielectric layer. A second conductive layer may be coupled to a second side of the ultra-thin dielectric layer, and the ultra-thin dielectric layer is thinner than at l...