US Patent Issued to Sandisk Technologies on Sept. 2 for "Three-dimensional memory device with backside support pillar structures and methods of forming the same" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,408,345, issued on Sept. 2, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Three-dimensional memory device with backside support pillar structures and methods of forming the same" was invented by Shunsuke Takuma (Yokkaichi, Japan), Yuji Totoki (Yokkaichi, Japan), Seiji Shimabukuro (Yokkaichi, Japan), Tatsuya Hinoue (Yokkaichi, Japan), Kengo Kajiwara (Yokkaichi, Japan) and Akihiro Tobioka (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "At least one vertically alternating sequence of continuous insulating layers and continuous sacrificial material layers is formed over a substrate. Rows of backside support pillar structure...