US Patent Issued to Sandisk Technologies on Sept. 1 for "Die level failure recovery" (Chinese, American Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,725,674, issued on Sept. 1, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Die level failure recovery" was invented by Xuan Tian (Shanghai), Liang Li (Shanghai), Tsingfa Li (Shanghai) and Jiahui Yuan (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Programming techniques disclosed herein may be used to recover from potential plane and/or die level failures. The memory system may detect evidence of a plane or die level failure that impacts memory operations performed in a target region of the blocks if a first programming technique is used in the target region. For example, the memory system may note that a significant numb...